Ultrafast temperature profile calculation in IC chips

Show simple item record

dc.contributor.author Kemper, T. en_US
dc.contributor.author Zhang, Y. en_US
dc.contributor.author Bian, Z. en_US
dc.contributor.author Shakouri, A. en_US
dc.date.accessioned 2006-12-12T13:48:23Z
dc.date.available 2006-12-12T13:48:23Z
dc.date.issued 2006 en_US
dc.identifier.citation Proceedings of 12th International Workshop on Thermal investigations of ICs, THERMINIC 2006, p. 133-137 en_US
dc.identifier.isbn 2-916187-04-9 en_US
dc.identifier.other handle TIMA 2243/therminic2006_UTP133 en_US
dc.identifier.uri http://hdl.handle.net/2042/6586
dc.description.abstract One of the crucial steps in the design of an integrated circuit is the minimization of heating and temperature non-uniformity. Current temperature calculation methods, such as finite element analysis and resistor networks have considerable computation times, making them incompatible for use in routing and placement optimization algorithms. In an effort to reduce the computation time, we have developed a new method, deemed power blurring, for calculating temperature distributions using a matrix convolution technique in analogy with image blurring. For steady state analysis, power blurring was able to predict hot spot temperatures within 1°C with computation times 3 orders of magnitude faster than FEA. For transient analysis the computation times where enhanced by a factor of 1000 for a single pulse and around 100 for multiple frequency application, while predicting hot spot temperature within about 1°C. The main strength of the power blurring technique is that it exploits the dominant heat spreading in the silicon substrate and it uses superposition principle. With one or two finite element simulations, the temperature point spread function for a sophisticated package can be calculated. Additional simulations could be used to improve the accuracy of the point spread function in different locations on the chip. In this calculation, we considered the dominant heat transfer path through the back of the IC chip and the heat sink. Heat transfer from the top of the chip through metallization layers and the board is usually a small fraction of the total heat dissipation and it is neglected in this analysis. en_US
dc.format.extent 91408 bytes
dc.format.mimetype application/pdf
dc.language.iso EN en_US
dc.publisher TIMA Editions , Grenoble, France en_US
dc.rights http://irevues.inist.fr/utilisation en_US
dc.source Proceedings of 12th International Workshop on Thermal investigations of ICs, THERMINIC 2006, p. 133-137 en_US
dc.subject Image blurring, Green's function, temperature-aware design, fast thermal simulation en_US
dc.title Ultrafast temperature profile calculation in IC chips en_US
dc.type Conference proceeding en_US
dc.contributor.affiliation Baskin School of Engineering - University of California Santa Cruz [United States] en_US
dc.contributor.affiliation Jack Baskin School of Engineering - University of California at Santa Cruz [USA] en_US
dc.contributor.affiliation Baskin School of Engineering - University of California Santa Cruz [United States] en_US
dc.contributor.affiliation Jack Baskin School of Engineering - University of California at Santa Cruz [USA] en_US


Files in this item

PDF UTP133.pdf 91.40Kb

This item appears in the following Collection(s)

Show simple item record





Advanced Search