Thermal measurement and modeling of multi-die packages

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dc.contributor.author Poppe, A. en_US
dc.contributor.author Zhang, Y. en_US
dc.contributor.author Wilson, J. en_US
dc.contributor.author Farkas, G. en_US
dc.contributor.author Szabo, P. en_US
dc.contributor.author Parry, J. en_US
dc.date.accessioned 2006-12-12T13:48:15Z
dc.date.available 2006-12-12T13:48:15Z
dc.date.issued 2006 en_US
dc.identifier.citation Proceedings of 12th International Workshop on Thermal investigations of ICs, THERMINIC 2006, p. 191-196 en_US
dc.identifier.isbn 2-916187-04-9 en_US
dc.identifier.other handle TIMA 2243/therminic2006_TMM191 en_US
dc.identifier.uri http://hdl.handle.net/2042/6580
dc.description.abstract Thermal measurement and modeling of multi-die packages became a hot topic recently in different fields like RAM chip packaging or LEDs / LED assemblies, resulting in vertical (stacked) and lateral arrangement. In our present study we show results for a mixed arrangement : an opto-coupler device has been investigated with 4 chips in lateral as well as vertical arrangement. In this paper we give an overview of measurement and modeling techniques and results for stacked and MCM structures, describe our present measurement results together with our structure function based methodology of validating the detailed model of the package being studied. Also, we show how to derive junction-to-pin thermal resistances with a technique using structure functions. en_US
dc.format.extent 849017 bytes
dc.format.mimetype application/pdf
dc.language.iso EN en_US
dc.publisher TIMA Editions , Grenoble, France en_US
dc.rights http://irevues.inist.fr/utilisation en_US
dc.source Proceedings of 12th International Workshop on Thermal investigations of ICs, THERMINIC 2006, p. 191-196 en_US
dc.subject thermal transient measurement, model validation, thermal modeling en_US
dc.title Thermal measurement and modeling of multi-die packages en_US
dc.type Conference proceeding en_US
dc.contributor.affiliation Department of Electron Devices - Budapest University of Technology and Economics [Hungary] en_US
dc.contributor.affiliation Flomerics - Flomerics Inc. [United States] en_US
dc.contributor.affiliation Flomerics - Flomerics Inc. [United States] en_US
dc.contributor.affiliation MicReD - MicReD Ltd. Budapest [Hungary] en_US
dc.contributor.affiliation Department of Electron Devices - Budapest University of Technology and Economics [Hungary] en_US
dc.contributor.affiliation Flomerics - Flomerics Inc. [United States] en_US


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