Reducing the possibility of subjective error in the determination of the structure-function-based effective thermal conductivity of boards

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dc.contributor.author Kollár, E. en_US
dc.contributor.author Szekely, V.
dc.date.accessioned 2006-12-12T13:48:04Z
dc.date.available 2006-12-12T13:48:04Z
dc.date.issued 2006 en_US
dc.identifier.citation Proceedings of 12th International Workshop on Thermal investigations of ICs, THERMINIC 2006, p. 28-32 en_US
dc.identifier.isbn 2-916187-04-9 en_US
dc.identifier.other handle TIMA 2243/therminic2006_RPS28 en_US
dc.identifier.uri http://hdl.handle.net/2042/6574
dc.description.abstract The thermal response function given to a unit-step dissipation accurately characterizes the thermal system. Instead of the thermal response function the so-called structure function describing three-dimensional as the equivalent model of one-dimensional heat-spreading, created from the thermal response function with the help of complex mathematical procedures, is often used. Using the structure function the partial thermal capacity and partial heat resistance of certain elements of the thermal system can be identified. If the geometrical measurements of a thermal system of simple geometry and homogeneous material (such as a homogeneous rod or board, etc.) are known, the coefficient of thermal conductivity of the material in question can be determined from two points of the structure function at 2-5 per cent of accuracy. In this paper a method is presented which applies a wide range/section instead of two points of the cumulative structure function to determine the thermal coefficient, thus reducing the subjective error deriving from the selection of the two points. The above method is presented and illustrated in simulated as well as measured thermal transient responses. en_US
dc.format.extent 474601 bytes
dc.format.mimetype application/pdf
dc.language.iso EN en_US
dc.publisher TIMA Editions , Grenoble, France en_US
dc.rights http://irevues.inist.fr/utilisation en_US
dc.source Proceedings of 12th International Workshop on Thermal investigations of ICs, THERMINIC 2006, p. 28-32 en_US
dc.subject structure-function, thermal conductivity, PCBs, en_US
dc.title Reducing the possibility of subjective error in the determination of the structure-function-based effective thermal conductivity of boards en_US
dc.type Conference proceeding en_US
dc.contributor.affiliation Department of Electron Devices - Budapest University of Technology and Economics [Hungary] en_US


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