Optimised curing of silver ink jet based printed traces

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dc.contributor.author Radivojevic, Z. en_US
dc.contributor.author Andersson, K. en_US
dc.contributor.author Hashizume, K. en_US
dc.contributor.author Heino, M. en_US
dc.contributor.author Mantysalo, M. en_US
dc.contributor.author Mansikkamaki, P. en_US
dc.contributor.author Matsuba, Y. en_US
dc.contributor.author Terada, N. en_US
dc.date.accessioned 2006-12-12T13:47:59Z
dc.date.available 2006-12-12T13:47:59Z
dc.date.issued 2006 en_US
dc.identifier.citation Proceedings of 12th International Workshop on Thermal investigations of ICs, THERMINIC 2006, p. 163-168 en_US
dc.identifier.isbn 2-916187-04-9 en_US
dc.identifier.other handle TIMA 2243/therminic2006_OCS163 en_US
dc.identifier.uri http://hdl.handle.net/2042/6571
dc.description.abstract Manufacturing electronic devices by printing techniques with low temperature sintering of nano-size material particles can revolutionize the electronics industry in coming years. The impact of this change to the industry can be significant enabling low-cost products and flexibility in manufacturing. implementation of a new production technology with new materials requires thorough elementary knowledge creation. It should be noticed that although some of first electronic devices ideally can be manufactured by printing, at the present several modules are in fact manufactured by using hybrid techniques (for instance photolithography, vapor depositions, spraying, etc...). en_US
dc.format.extent 2857362 bytes
dc.format.mimetype application/pdf
dc.language.iso EN en_US
dc.publisher TIMA Editions , Grenoble, France en_US
dc.rights http://irevues.inist.fr/utilisation en_US
dc.source Proceedings of 12th International Workshop on Thermal investigations of ICs, THERMINIC 2006, p. 163-168 en_US
dc.subject printed electronics, optimised curing, thermomechanical stress en_US
dc.title Optimised curing of silver ink jet based printed traces en_US
dc.type Conference proceeding en_US
dc.contributor.affiliation Nokia Research Center - Nokia Helsinki [Finland] en_US
dc.contributor.affiliation Nokia Research Center - Nokia Helsinki [Finland] en_US
dc.contributor.affiliation Nokia Research Center - Nokia Tokyo [Japan] en_US
dc.contributor.affiliation Nokia Research Center - Nokia Helsinki [Finland] en_US
dc.contributor.affiliation Tampere University of Technology - Tampere University of Technology [Finland] en_US
dc.contributor.affiliation Tampere University of Technology - Tampere University of Technology [Finland] en_US
dc.contributor.affiliation Tsukuba Research Laboratory Harima Chemicals - Tsukuba Research Laboratory Harima Chemicals Inc [Japan] en_US
dc.contributor.affiliation Tsukuba Research Laboratory Harima Chemicals - Tsukuba Research Laboratory Harima Chemicals Inc [Japan] en_US


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