Thermal Stress Failures : A New Experimental Approach For Prediction and Prevention

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URI: http://hdl.handle.net/2042/6569
Title: Thermal Stress Failures : A New Experimental Approach For Prediction and Prevention
Author: Hertl, M.; Fayolle, R.; Weidmann, D.; Lecomte, J.-C.
Abstract: A new experimental tool for analyzing the topography and deformation of electronics components under thermo-mechanical stress is presented. Application examples are shown for a great variety of components, for localizing and quantifying deformations of electronic assemblies. Cooling and heating cycles following JEDEC type thermal profiles have been applied on different components, both before and after assembly. Simultaneously, real time topography and deformation measurements are obtained. These capabilities constitute a powerful tool for failure prediction, risk evaluation, and accelerated development. The high resolution optical setup allows analysis of deformations in the micrometer range, even for very irregularly shaped surfaces.
Subject: topography and deformation measurement, thermo-mechanical solicitation, experimental failure analysis
Publisher: TIMA Editions , Grenoble, France
Date: 2006

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