Heatring - Smart Investigation of Temperature Impact On Integrated Circuit Devices

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URI: http://hdl.handle.net/2042/6559
Title: Heatring - Smart Investigation of Temperature Impact On Integrated Circuit Devices
Author: Nentchev, A.; Cervenka, J.; Marnaus, G.; Enichlmair, H.; Selberherr, S.
Abstract: To investigate the electrical on-chip-transistor behavior at different temperatures usually the transistor area on the wafer is heated by external heat sources to operate at a specific temperature. To avoid using external heat sources a heatring structure was developed which directly controls the temperature of the investigated transistor area on the wafer, guaranteeing very fast warming up and cooling off duration times. Testing the heatring functionality was performed by electro-thermal simulations, the results of which were verified by measurements. Keywords : heatring, electro-thermal simulation
Subject: heatring, electro-thermal simulation
Publisher: TIMA Editions , Grenoble, France
Date: 2006

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