An Extendable Multi-Purpose Simulation and Optimization Framework for Thermal Problems in TCAD Applications

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URI: http://hdl.handle.net/2042/6554
Title: An Extendable Multi-Purpose Simulation and Optimization Framework for Thermal Problems in TCAD Applications
Author: Holzer, S.; Wagner, M.; Sheikholeslami, A.; Karner, M.; Span, G.; Grasser, T.; Selberherr, S.
Abstract: We present the capabilities of our optimization framework in conjunction with typical applications for thermal problems. Our software package supports a wide rage of simulators and optimization strategies to improve electronic devices in terms of speed, reliability, efficiency, and to reduce thermal degradation due to mechanical influences. Moreover, we show several optimization examples, where we succeeded to extract electro-thermal material and process parameters. These new material parameters can be applied to more complex device structures and to obtain a better insight into the physics of semiconductor devices.
Subject: Electro-thermal simulation, optimization of thermal problems, optimization framework, investigation of thermal problems for TCAD applications
Publisher: TIMA Editions , Grenoble, France
Date: 2006

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