A Coupled Thermoreflectance Thermography Experimental System and Ultra-Fast Adaptive Computational Engine for the Complete Thermal Characterization of Three-Dimensional Electronic Devices : Validation

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dc.contributor.author Burzo, M. en_US
dc.contributor.author Raad, P.-E.
dc.contributor.author Komarov, P.-L.
dc.date.accessioned 2006-12-12T13:47:24Z
dc.date.available 2006-12-12T13:47:24Z
dc.date.issued 2006 en_US
dc.identifier.citation Proceedings of 12th International Workshop on Thermal investigations of ICs, THERMINIC 2006, p. 138-143 en_US
dc.identifier.isbn 2-916187-04-9 en_US
dc.identifier.other handle TIMA 2243/therminic2006_CTTE138 en_US
dc.identifier.uri http://hdl.handle.net/2042/6548
dc.description.abstract This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface temperature scanning approach with a CCD camera-based approach. As before, the thermo-reflectance thermography system is used to non-invasively measure with submicron resolution the 2D surface temperature field of an activated device. The measured temperature field is then used as input for an ultra-fast inverse computational solution to fully characterize the thermal behavior of the complex three-dimensional device. For the purposes of this investigation, basic micro-heater devices were built, activated, and measured. In order to quantitatively validate the coupled experimental-computational system, the system was used to extract geometric features of a known device, thus assessing the system's ability to combine measured experimental results and computations to fully characterize complex 3D electronic devices. en_US
dc.format.extent 797649 bytes
dc.format.mimetype application/pdf
dc.language.iso EN en_US
dc.publisher TIMA Editions , Grenoble, France en_US
dc.rights http://irevues.inist.fr/utilisation en_US
dc.source Proceedings of 12th International Workshop on Thermal investigations of ICs, THERMINIC 2006, p. 138-143 en_US
dc.subject Coupled experimental-numerical, ultra-fast adaptive computational engine, three-dimensional thermal characterization, complex electronic devices, validation, inverse solution en_US
dc.title A Coupled Thermoreflectance Thermography Experimental System and Ultra-Fast Adaptive Computational Engine for the Complete Thermal Characterization of Three-Dimensional Electronic Devices : Validation en_US
dc.type Conference proceeding en_US
dc.contributor.affiliation Nanoscale Electro-Thermal Sciences Laboratory Department of Mechanical Engineering - Southern Methodist University TX [United States] en_US


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