Advanced Compact Thermal Modeling by using VHDL-AMS

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dc.contributor.author Habra, W. en_US
dc.contributor.author Tounsi, P. en_US
dc.contributor.author Dorkel, J.-M. en_US
dc.date.accessioned 2006-12-12T13:47:15Z
dc.date.available 2006-12-12T13:47:15Z
dc.date.issued 2006 en_US
dc.identifier.citation Proceedings of 12th International Workshop on Thermal investigations of ICs, THERMINIC 2006, p. 225-228 en_US
dc.identifier.isbn 2-916187-04-9 en_US
dc.identifier.other handle TIMA en_US
dc.identifier.uri http://hdl.handle.net/2042/6542
dc.description.abstract This paper presents an improved methodology to generate Compact Thermal Models "CTMs" by using (VHDL-AMS) modeling language. This methodology makes it possible to have Boundary Conditions Independent "BCI" CTMs for multi chip components and systems while taking into account the nonlinear thermal conductivity of semiconductors and other materials. en_US
dc.format.extent 121934 bytes
dc.format.mimetype application/pdf
dc.language.iso EN en_US
dc.publisher TIMA Editions , Grenoble, France en_US
dc.rights http://irevues.inist.fr/utilisation en_US
dc.source Proceedings of 12th International Workshop on Thermal investigations of ICs, THERMINIC 2006, p. 225-228 en_US
dc.subject Compact modeling thermal simulation vhdl-ams en_US
dc.title Advanced Compact Thermal Modeling by using VHDL-AMS en_US
dc.type Conference proceeding en_US
dc.contributor.affiliation LAAS - LAAS/CNRS [France] en_US
dc.contributor.affiliation LAAS - LAAS/CNRS [FRANCE] en_US
dc.contributor.affiliation LAAS - LAAS/CNRS [France] en_US


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