Minimizing the Bondline Thermal Resistance in Thermal Interface Materials Without Affecting Reliability

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URI: http://hdl.handle.net/2042/6438
Title: Minimizing the Bondline Thermal Resistance in Thermal Interface Materials Without Affecting Reliability
Author: Emerson, J.; Rightley, M.; Galloway, J.; Huber, D.; Rae, D.; Cotts, E.
Abstract: Electronic assemblies thermal interface materials As electronic assemblies become more compact, with increased processing bandwidth and higher energy fluxes, thermal management is limiting several critical applications. The major technology limitation is the nonmetallic joining of devices to heat sinks using existing commercial thermal interface materials (TIMs). The present study starts a systematic study of the coupled interactions between materials formulation, manufacturing process, and thermal performance.
Subject: Electronic assemblies thermal interface materials (TIM) thermal conductivity adhesive surface sciences heat transport at sub-micron scales in microelectronics packaging bondline microstructure laser flash diffusivity measurements
Publisher: TIMA Editions , Grenoble, France
Date: 2006

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