Mechanism and thermal effect of delamination in light-emitting diode packages

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dc.contributor.author Hu, Jianzheng
dc.contributor.author Yang, Lianqiao
dc.contributor.author Shin, Moo-Whan
dc.date.accessioned 2006-12-12T13:07:38Z
dc.date.available 2006-12-12T13:07:38Z
dc.date.issued 2006 en_US
dc.identifier.citation International Workshop on Thermal Investigation og ICs ans Systems, 27-30 Sep 2005, Belgirate Lake Maggiore, Italy, p 249-254 en_US
dc.identifier.isbn 2-916187-01-04 en_US
dc.identifier.other handle TIMA 2243/THERM2005_1022 en_US
dc.identifier.uri http://hdl.handle.net/2042/6430
dc.description.abstract In this paper we report on the mechanism of delamination in light-emitting diode (LED) packages and its effects on thermal characteristics of LEDs. The LED samples were subjected to moisture preconditioning treatments followed by heat block testing. Transient thermal measurements were performed for the investigation of the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement test. Thermo-mechanical stress and hygro-mechanical stress in the LED package were obtained by coupled-field analysis using FEA. The calculated thermo-mechanical and hygro-mechanical stress distributions agree well with the micrographical evidence. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 hrs and 6 hrs under 85°C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame. Significant delamination was expected for the samples experienced the moisture preconditioning for 24 hrs. en_US
dc.format.extent 460673 bytes
dc.format.mimetype application/pdf
dc.language.iso EN en_US
dc.publisher TIMA Editions , Grenoble, France en_US
dc.rights http://irevues.inist.fr/utilisation en_US
dc.source International Workshop on Thermal Investigation og ICs ans Systems, 27-30 Sep 2005, Belgirate Lake Maggiore, Italy, p249-254 en_US
dc.subject Delamination, light-emitting diode (LED), structure function, thermal resistance,transient thermal measurement thermal stress, hygroscopic stress en_US
dc.title Mechanism and thermal effect of delamination in light-emitting diode packages en_US
dc.type Conference proceeding en_US
dc.contributor.affiliation Department of Materials Science & Engineering - Myong Ji university [Korea]


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