Transient compact modeling for multi chips components

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Title: Transient compact modeling for multi chips components
Author: Habra, W.; Tounsi, P.; Dorkel, J.-M.
Abstract: In this paper, we present a methodology to generate transient 3D Nonlinear Compact Thermal Models (CTMs) for multi-chip electronic components and systems. This method is based on defining the Optimal Thermal Coupling Point (OTCP) that simplifies generating the CTMs. The CTMs are presented by RC network that enables us to make full and fast electro-thermal calculations in one simulation process by using PSpice or any electrical simulation software. This paper is a continuity for research work that aims at reducing the number of RC elements, indeed the proposed work differs from nodal method that induce significant number of RC elements, while remaining faithful to the physical phenomena to model.
Publisher: TIMA Editions , Grenoble, France
Date: 2006

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