Thermal Modeling of power hybrid modules

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Title: Thermal Modeling of power hybrid modules
Author: Abid, S.; Ammous, A.; Ayadi, M.
Abstract: Accurate prediction of temperature variation of power semiconductor devices in power electronic circuits is important to obtain optimum designs and estimate reliability levels. Temperature estimation of power electronic devices has generally been performed using transient thermal equivalent circuits. In this paper we have developed a simplified thermal model of the power hybrid module. This model takes into account the thermal mutual between the different module chips based on the technique of superposition.
Subject: Hybrid module, thermal model, thermal mutual.
Publisher: TIMA Editions , Grenoble, France
Date: 2006

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