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Showing 10 out of a total of 48 results for collection: 2006 - Proceedings of 12th International Workshop on Thermal investigations of ICs. (0.031 seconds)
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(TIMA Editions , Grenoble, France, 2006)High linear voltage references circuitry are designed and implemented in TSMC 0.18µm CMOS technology. Previous research has proposed the use of MOS transistors operating in the weak inversion region to replace the bipolar devices in conventional PTAT(proportional to absolute temperature) circuits. However such solutions often have linearity problem in high temperature region due to the current leaking devices in modern deep sub micron and nano-scale CMOS technology. The proposed circuit utilized temperature complementation technique on two voltage references, PTAT and IOAT (independent of absolute temperature) references, to enhance the linearity and produce a more stable IOAT voltage reference. Base on the simulation results, the R-squares of both circuitries are better than 0.999 in a considerable wider temperature range from - 55°C to 170°C. Thus, a fully integrated temperature sensor with wider temperature range is designed and easily to integrate to modern system-on-chip designs with minimal efforts....
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(TIMA Editions , Grenoble, France, 2006)This paper presents the consideration of the presence and the influence of non-linear distortion of photo-acoustic measurement set-up on the results of thermal properties analysis for the multi-layer semiconductor structure. The authors propose a method which will eliminate such an influence....
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(TIMA Editions , Grenoble, France, 2006)System level design of battery operated sensor networks needs high level battery models. As these sensors may operate on very different temperatures the battery models need to be temperature dependent. The paper presents the steps of creating temperature dependent battery models....
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(TIMA Editions , Grenoble, France, 2006)In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effec-tive dissipation of heat. This can be achieved by the optimization of the system design with the help of simulation methods. The precision of these models relies also on the used material data. For the determi-nation of this data an experimental set-up for a static measurement is presented, which evaluates thermal conductivity and interface resistance of thermal inter-face materials (e.g. adhesive, solder, pads, or pastes). A qualitative structure-property correlation is pro-posed taking into account particle size, filler content and void formation at the interface based on high resolution FIB imaging. The paper gives an overview over the set-up and the measurement technique and discusses experimental and simulation results....
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(TIMA Editions , Grenoble, France, 2006)Electronics warming has broad applications in the aerospace industry, where electronics assemblies are subject to lower than recommended temperature environments. Prior to operation it is necessary to raise the temperature of the electronics to the minimum safe operating level, recommended by the manufacturer. This is managed by adding an electrical heater inside the electronics assembly enclosure. A very important characteristic of the heater is how quickly the desired temperature needs to be reached. Of course, this characteristic determines the size of the heater needed for the warm up process. Since relatively low failure mode temperatures are often required by the aerospace industry, there is an additional level of complexity involved in designing the optimum size of a heater. In a failure mode condition, the analysis requires a heater to be sized to produce a small amount of heat even under hot environmental conditions. The two requirements of fast warm up time and low failure mode temperatures seem contradictory. The art of the Thermal Management in this type of design is to come up with a specific optimum heater size that can satisfy a rapid warm up requirement and yet not exceed the maximum allowable temperature during a failure mode scenario. Often a thermal engineer needs to work with an electrical engineer to manipulate the control algorithm for the heater in order to satisfy these two requirements. This study will investigate how to approach such a problem and how one can size such heater. Also, optimization techniques are considered in order to choose the proper design among all available solutions. There are two different ways to achieve a desired warm up time of a cold soaked electronics assembly. The first approach may require some manipulation of the location of the heater inside the box or the addition of insulating materials. This approach captures the heat generated by the heater inside the enclosure in order to achieve quicker warm up period. However, the presence of an insulator increases the risk of dangerously high temperatures during a failure mode scenario. To alleviate the insulator effect, the external enclosure heat dissipation mechanism must be altered. This kind of modification is costly and requires additional design steps. This is where the benefit of the second approach comes in. Namely, the desired result of a fast warm up time and lower failure mode temperatures can be achieved by manipulating the heater controller and controlling the amount of power to the heater. A Pulse Width Modulation (PWM) Controller can be used to control not only the amount of heat generated by a heater, but also the percentage of heater "on” time within one pulse width and therefore the warm up time. Having the ability to control the frequency of releasing heat into the cold enclosure allows us to indicate two new parameters : the amount of heat load and the heat load frequency of inserting heat. A thermal management scheme can be developed to optimize the most efficient pair of values that will meet warm up time and failure mode temperature criteria. An analytical model is developed to study the thermal management of such a problem. The analytical model is used to perform an optimization study and to recommend a heater controller design for a given required specification....
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(TIMA Editions , Grenoble, France, 2006)One of the crucial steps in the design of an integrated circuit is the minimization of heating and temperature non-uniformity. Current temperature calculation methods, such as finite element analysis and resistor networks have considerable computation times, making them incompatible for use in routing and placement optimization algorithms. In an effort to reduce the computation time, we have developed a new method, deemed power blurring, for calculating temperature distributions using a matrix convolution technique in analogy with image blurring. For steady state analysis, power blurring was able to predict hot spot temperatures within 1°C with computation times 3 orders of magnitude faster than FEA. For transient analysis the computation times where enhanced by a factor of 1000 for a single pulse and around 100 for multiple frequency application, while predicting hot spot temperature within about 1°C. The main strength of the power blurring technique is that it exploits the dominant heat spreading in the silicon substrate and it uses superposition principle. With one or two finite element simulations, the temperature point spread function for a sophisticated package can be calculated. Additional simulations could be used to improve the accuracy of the point spread function in different locations on the chip. In this calculation, we considered the dominant heat transfer path through the back of the IC chip and the heat sink. Heat transfer from the top of the chip through metallization layers and the board is usually a small fraction of the total heat dissipation and it is neglected in this analysis....
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(TIMA Editions , Grenoble, France, 2006)This article deals with the creation of a compact thermal model. In this aim, we apply some well-known methods such as FEM model reduction and identification of RC networks. To go further than already existing approaches, we also introduce the use of artificial neural networks (ANNs) to cope with nonlinearities which may appear in thermal phenomenons. A new hybrid model, trying to gather the advantages of ANNs and RC networks, is applied on a simple thermal problem. The need of samples will also lead us to carry out, in parallel, the FEM model reduction. The reduced FEM model will then be used to generate the required databases and validate the compact model results....
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(TIMA Editions , Grenoble, France, 2006)This paper presents dynamic thermal analyses of a power amplifier. All the investigations are based on the transient junction temperature measurements performed during the circuit cooling process. The presented results include the cooling curves, the structure functions, the thermal time constant distribution and the Nyquist plot of the thermal impedance. The experiments carried out demonstrated the influence of the contact resistance and the position of the entire cooling assembly on the obtained results....
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(TIMA Editions , Grenoble, France, 2006)Using the finite volume CFD software FLUENT, one fan was studied at a given flow rate (1.5m3/min) for three different operational rotating speeds : 2,000, 2,350 and 2,700 rpm. The turbulent air flow analysis predicts the acoustic behavior of the fan. The best fan operating window, i.e. the one giving the best ratio between noise emissions and cooling performance, can then be determined. The broadband noise acoustic model is used. As the computation is steady state, a simple Multiple Reference Frame model (MRF, also known as stationary rotor approach) is used to represent the fan. This approach is able to capture the effects of the flow non-uniformity at the fan inlet together with their impact on the fan performance. Furthermore, it is not requiring a fan curve as an input to the model. When compared to the available catalog data the simulation results show promising qualitative agreement that may be used for fan design and selection purposes....
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(TIMA Editions , Grenoble, France, 2006)Galliumnitride has become a strategic superior material for space, defense and civil applications, primarily for power amplification at RF and mm-wave frequencies. For AlGaN/GaN high electron mobility transistors (HEMT), an outstanding performance combined together with low cost and high flexibility can be obtained using a System-in-a-Package (SIP) approach. Since thermal management is extremely important for these high power applications, a hybrid integration of the HEMT onto an AlN carrier substrate is proposed. In this study we investigate the temperature performance for AlGaN/GaN HEMTs integrated onto AlN using flip-chip mounting. Therefore, we use thermal simulations in combination with experimental results using micro-Raman spectroscopy and electrical dc-analysis....