2006 - Proceedings of 12th International Workshop on Thermal investigations of ICs
Invited talk1 : Enabling electronic prognostics using thermal data
Session 1 : Temperature measurements
- Thermal properties of high power laser bars investigated by spatially resolved thermoreflectance spectroscopy
- CCD thermoreflectance thermography system : methodology and experimental validation
- -55°C TO 170°C high linear voltage references circuitry in 0.18ìm CMOS technology
- Temperature measurement in the Intel® CoreTM Duo Processor
Poster introduction session
- Reducing the possibility of subjective error in the determination of the structure-function-based effective thermal conductivity of boards
- The application of Artificial Neural Network for the assessment of thermal properties of multi-layer semiconductor structure
- A Temperature Analysis of High-power AlGaN/GaN HEMTs
- Flow Visualization of The Buoyancy-induced Convective Heat Transfer in Electronics Cooling
- Contactless thermal characterization method of PCB-S using different IR sensor arrays
- The method of non-linear distortions elimination in photoacoustic investigation of layered semiconductor structure
- Canonical Forms of Multi-Port Dynamic Thermal Networks
- Thermal Modeling of high power LED modules
- Creating temperature dependent Ni-MH battery models for low power mobile devices
- Electronics Cooling Fan Noise Prediction
- Liquid Cooling of Bright LEDs for Automotive Applications
- Thermal Design of Power Semiconductor Modules for Mobile Communication Systems
- Failure Analysis and Field Failures : a Real Shortcut to Reliability Improvement
- A More Flexible Realization of The SUNRED Algorithm
- Reliability Evaluation Method for Electronic Device BGA Package Considering the Interaction Between Design Factors
- Modeling with structure of resins in electonic compornents
Session 2 : Thermal simulation
- Electronics warning and optimization study subject to low temperature environments
- Model Reduction for Power Electronics Systems with Multiple Heat Sources
- Dynamic Compact Thermal Model with Neural Networks for Radar Applications
- Thermal Transient Multisource Simulation Using Cubic Spline Interpolation of Zth Functions
- Dynamic Thermal Analysis of a Power Amplifier
- Ultrafast temperature profile calculation in IC chips
- A Coupled Thermoreflectance Thermography Experimental System and Ultra-Fast Adaptive Computational Engine for the Complete Thermal Characterization of Three-Dimensional Electronic Devices : Validation
Session 3 : Measurement of thermal properties
- Characterization of thermal interface materials to support thermal simulation
- Measurements of thermophysical property of thin films by light pulse heating thermoreflectance methods
- Thermal Transient Characterization of Packaged Thin Film Microcoolers
Session 4 : Reliability
- Optimised curing of silver ink jet based printed traces
- Thermal Stress Failures : A New Experimental Approach For Prediction and Prevention
Session 5 : Thermal modeling and investigation of packages
- Localized LNA cooling in vacuum
- Nonlinear Projection-Based Approach for Generating Compact Models of Nonlinear Thermal Networks
- Design issues of a variable thermal resistance
- Thermal measurement and modeling of multi-die packages
- Electrical, thermal and optical characterization of power LED assemblies
- Thermal Benchmark and Power Benchmark Software
Special session
- Advanced temperature measurements at Sub-Micron scales
- Quantitative 3w-scanning thermal microscopy : Modelling the AC/DC coupling and the sample heat conduction
Session 6 : Electrothermal simulation and modeling
- The hot-spot phenomenon and its countermeasures in bipolar power transistors by analytical electro-thermal simulation
- Lumped electro-thermal model of on-chip interconnects
- Advanced Compact Thermal Modeling by using VHDL-AMS
- Thermal and Sensitivity Analysis of Multi-Fin Devices
- Heatring - Smart Investigation of Temperature Impact On Integrated Circuit Devices
- An Extendable Multi-Purpose Simulation and Optimization Framework for Thermal Problems in TCAD Applications
- TherMos3, a tool for 3D electrothermal simulation of Smart Power Mosfets
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(TIMA Editions , Grenoble, France, 2006)
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(TIMA Editions , Grenoble, France, 2006)
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(TIMA Editions , Grenoble, France, 2006)
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(TIMA Editions , Grenoble, France, 2006)
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