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Browsing 2005 - International Workshop on Thermal Investigation of ICs and Systems by Issue Date

Now showing items 1-20 of 48

Analytical thermal stress modeling in physical design for reliability of micro and opto electronic systems : Role, attributes, challenges, results

Suhir, E. (TIMA Editions , Grenoble, France, 2006)
Thermal Modeling of power hybrid modules

Abid, S.; Ammous, A.; Ayadi, M. (TIMA Editions , Grenoble, France, 2006)
Effect of temperature of vibrations of physically non linear piezoelectric rods

Birman, V.; Suhir, E. (TIMA Editions , Grenoble, France, 2006)
Transient thermal simulation of a power hybrid module using an analytical solution of the heat equation

Janicki, M.; De Mey, G.; Napieralski, A. (TIMA Editions , Grenoble, France, 2006)
Effect of Assembly Stiffness and Solder Properties on Thermal Cycle Acceleration Factors

Darveaux, R. (TIMA Editions , Grenoble, France, 2006)
Error indicator to automatically generate dynamic compact parametric thermal models

Marco, S.; Korvink, J.-G.; Rudnyi, E.-B.; Feng, L.; Salleras, M. (TIMA Editions , Grenoble, France, 2006)
Inverse thermal problem via model order reduction : determining material properties of a microhotplate

Bechtold, T.; Hohlfeld, D.; Rudnyi, E.-B.; Zappe, H.; Korvink, J.-G. (TIMA Editions , Grenoble, France, 2006)
Temperature Gradient Alleviating Method for Arithmetic Units

Egawa, R.; Ito, M.; Hasegawa, N.; Nakamura, T.; Suzuki, K.-I. (TIMA Editions , Grenoble, France, 2006)
Smoke and CFD visualization of the flow after an EMIC screen in a subrack model

Antón, R.; Castiella, M.; Jonsson, H.; Moshfegh, B. (TIMA Editions , Grenoble, France, 2006)
Two-Dimensional Temperature Fields in ASICs for Multiple Heat Sources of Arbitrary Power Dissipation Derived from Conformal Mapping Theory

Augustin, A.; Kostka, A.; Maj, B. (TIMA Editions , Grenoble, France, 2006)
Model reduction for thermo-mechanical simulation of packages

Zukowski, E.; Wilde, J.; Rudnyi, E.-B.; Korvink, J.-G. (TIMA Editions , Grenoble, France, 2006)
Thermal-aware design rules for nanometer ICs

Rossello, J.-L.; Bota, S.; Keshavarzi, A.; Segura, J.; Rosales, M. (TIMA Editions , Grenoble, France, 2006)
Reliability study of power RF LDMOS devices under thermal stress

Ketata, K.; Gares, M.; Mourgues, K.; Marcon, J.; Belaid, M.-A.; Masmoudi, M. (TIMA Editions , Grenoble, France, 2006)
Transient compact modeling for multi chips components

Habra, W.; Tounsi, P.; Dorkel, J.-M. (TIMA Editions , Grenoble, France, 2006)
Qualitative Temperature Variation Imaging by Thermoreflectance and SThM Techniques

Grauby, S.; Salhi, A.; Dilhaire, S.; Charlot, B.; Claeys, W.; Cretin, B.; Tessier, G.; Trannoy, N.; Vairac, P.; Volz, S.; Gomès, S.; Patino Lopez, L. (TIMA Editions , Grenoble, France, 2006)
Mechanism and thermal effect of delamination in light-emitting diode packages

Hu, Jianzheng; Yang, Lianqiao; Shin, Moo-Whan (TIMA Editions , Grenoble, France, 2006)
Determination of Thermophysical Properties of Si/SiGe Superlattices with a Pump-Probe Technique

Ezzahri, Y.; Grauby, S.; Dilhaire, S.; Rampnoux, J.-M.; Claeys, W.; Zhang, Y.; Shakouri, A. (TIMA Editions , Grenoble, France, 2006)
An Adaptive-Grain Thermal Simulation Method to Evaluate Effects of Spatio-Temporal Analysis Granularity upon The Thermal Behavior of VLSIs

Ito, M.; Hesegawa, N.; Egawa, R.; Suzuki, K.I.; Nakamura, T. (TIMA Editions , Grenoble, France, 2006)
Structure Function Representation of Multi-Directional Heat-Flows

Codecasa, L.; D'Amore, D.; Maffezzoni, P. (TIMA Editions , Grenoble, France, 2006)
Validation of the DJOSER analytical thermal simulator for electronic power devices and assembling structures

Bagnoli, P.-E.; Bartoli, C.; Stefani, F.; Franchi, E. (TIMA Editions , Grenoble, France, 2006)

Now showing items 1-20 of 48

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