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Browsing 2006 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS by Title

Now showing items 1-20 of 64

3D Assembly technology for hybrid integration of heterogenous devices

Jung, E.; Schmitz, S.; Kaschlun, K.; Magagni, L.; Fazzi, A.; Guerrieri, R.; Canegallo, R. (TIMA Editions , Grenoble, France, 2006)
3-D self-assembled SOI MEMS : an example of multiphysics simulation

Louis, C.; Paquay, S.; De Vincenzo, P.; Klapka, I.; Rochus, V.; Iker, F.; André, Nicolas; Raskin, J.-P.; Mendez, C. (TIMA Editions , Grenoble, France, 2006)
Above IC micro-power generators for RF-MEMS

Oukassi, S.; Salot, R.; Bancel, S.; Pereira-Ramos, J.-P.; Gagnard, X. (TIMA Editions , Grenoble, France, 2006)
An active chaotic micromixer integrating thermal actuation associating PDMS and silicon microtechnology

Français, O.; Jullien, M.-C.; Rousseau, L.; Poulichet, P.; Desportes, S.; Chouai, A.; Lefevre, J.-P.; Delaire, J. (TIMA Editions , Grenoble, France, 2006)
AFM, SEM and nano/micro-indention studies of the FIB-MILLED glassy carbon surface heat-treated at different conditions

Youn, S.-W.; Takahashi, M.; Goto, H.; Maeda, R.; Kobayashi, N. (TIMA Editions , Grenoble, France, 2006)
Analysis of packaging effects on the performance of the microflown

Yntema, D.-R.; Dijkstra, M.; Svetovoy, V.-B.; Wiegerink, R.-J.; Elwenspoek, M.; Van Honschoten, J. (TIMA Editions , Grenoble, France, 2006)
Analytic model for perforated squeezed-film dampers

Veijola, T. (TIMA Editions , Grenoble, France, 2006)
AU-SN FLIP-CHIP solder bump for microelectronic and optoelectronic applications

Yoon, Jeong-Won; Koo, Ja-Myeong; Jung, Seung-Boo; Chun, Hyun-Suk (TIMA Editions , Grenoble, France, 2006)
Capacitive test-structures design methodology for the extraction of AIR-GAP and dielectric thickness of a MEMS process

Bellei, M.; Margesin, B.; Gaddi, R.; Gnudi, A.; Giacomozzi, F. (TIMA Editions , Grenoble, France, 2006)
Characterization of flexible RF microcoil dedicated to surface MRI

Woytasik, M.; Ginefri, J.-C.; Raynaud, J.-S.; Poirier-Quinot, M.; Dufour-Gergam, E.; Grandchamp, J.-P.; Darrasse, L.; Robert, P.; Gilles, J.-P.; Martincic, E.; Girard, O. (TIMA Editions , Grenoble, France, 2006)
Characterization of friction during the demolding of microstructures molded by hot embossing

Worgull, M.; Heckele, M.; Hétu, J.-F.; Kabanemi, K.-K. (TIMA Editions , Grenoble, France, 2006)
Characterization of the etching quality in micro-electro-mechanical systems by thermal transient methodology

Szabo, P.; Nemeth, B.; Rencz, M.; Courtois, B. (TIMA Editions , Grenoble, France, 2006)
Concave microlens array mold fabrication in photoresist using UV proximity printing

Lin, Tsung-Hung; Yang, Hsiharng; Chao, Ching-Kong (TIMA Editions , Grenoble, France, 2006)
Contactless thermal characterization method of PCB-S using an IR sensor array

Rencz, M.; Szekely, V.; Bognár, G. (TIMA Editions , Grenoble, France, 2006)
Design and development of novel electroplating spring frame MEMS structure specimens for the microtensile testing of thin film materials

Lin, Ming-Tzer; Tong, Chi-Jia; Chiang, Chung-Hsun (TIMA Editions , Grenoble, France, 2006)
Design and fabrication of a micro electrostatic vibration-to-electricity energy converter

Chiu, Yi; Chu, Yu-Shan; Kuo, Chiung-Ting (TIMA Editions , Grenoble, France, 2006)
Design and fabrication of a novel light guiding plate for backlight system by MEMS technology

Chen, Zhi Peng; Chien, Chao-Heng (TIMA Editions , Grenoble, France, 2006)
The design and fabrication of platform device for DNA amplification

Yu, Hui-Min; Chien, Chao-Heng (TIMA Editions , Grenoble, France, 2006)
Design of bossed silicon membranes for high sensitivity microphone applications

Martins, P.; Beclin, S.; Metivet, S.; Stojanovic, O.; Malhaire, C. (TIMA Editions , Grenoble, France, 2006)
Development of scanning MEMS mirror with new assembly structure

Wang, Z.-F.; Noell, W.; Zickar, M.; De Rooij, N.; Lim, S.-P. (TIMA Editions , Grenoble, France, 2006)

Now showing items 1-20 of 64

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