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2006 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS >
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Browsing 2006 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS by Subject

Now showing items 1-20 of 63

Subject
3D integration, submicron, heterogenous circuits, capacitive signal coupling
Active micromixer - PDMS - Microheater - Chaotic effects - Microfluidic
Bio-chip, fluorescence detection, fiber sensor, micrsoystem
Compact model, gas damping, Reynolds equation, squeezed-film damper perforation
Deformable mirror, fiber laser, Q-switch, FEM simulation, mechanical and optical characterization
Devices and components (sensors, actuators, ...)
DNA amplification ; bulk micromachining ; thin-film heater
Electroformed nickel microparts
Electroplating, thin-film package, low temperature, etch holes
Electrostatic parallel-plate actuators, fringing capacitance, simulation of MEMS, MEMS control
Energy conversion, piezoelectric, vibration, power generator, nonlinear techniques
Eutectic indium-tin (In-48Sn) Solder, surface finish, metallization, ball shear test, mechanical reliability, intermetallic compound (IMC)
FEM, Electrostatic force, Strong Electro-mechanical Formulation, Deformable micro-mirror
Field Emission, Micromachining, Surface Conditioning, DRIE
Flat-panel-display packaging, Contact resistance model, Anisotropic conductive film
Flexible microcoil, micromoulding, IRM
Focused Ion Beam milling, Glass imprint, Glassy carbon, Heat-treatment, Nano/micro-indentation test, Atomic force microscopy, Optical interferometer, Scanning electron microscope
Friction, Demolding, Hot embossing, Simulation
Harsh condition, microcoil, failure mode, high current density, MEMS reliability
High Q inductor, RF passive devices, dielectrics dry etching, Cu electroplating, lift-off proces

Now showing items 1-20 of 63

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