Browsing 2006 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS by Author

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Authors Name
Darrasse, L.
deis - University of Bologna [Italy]
Delaire, J.
Département Traitement du Signal and Systèmes Electroniques - SUPELEC [France]
Department of electrical and control engineering - National Chiao Tung University [Taiwan]
Department of Electrical and Electronic Engineering - Imperial College London [United Kingdom]
Department of Electron Devices - Budapest University of Technology and Economics [Hungary]
Department of Electron Devices - Technical University of Budapest [Hungary]
Department of Materials Processing, Graduate School of Engineering - Tohoku University [Japan]
Department of Mechanical Engineering, Faculty of Engineering - International islamic University Malaysia [Malaysia]
Department of mechanical engineering - National Chung Hsing Univeristy [Taiwan]
Department of Mechanical Engineering - National Chung-Hsing University [Taiwan]
Department of Microsystems Engineering (IMTEK) - University of Freiburg [Germany]
Dep. of Mechanical Engineering - National Taiwan University of Science and Technology, Taipei [Taiwan]
De Rooij, N.
Desportes, S.
De Vincenzo, P.
Dhum, Ch.
Dijkstra, M.
Dipartimento di Ingegneria dell’Informazione - Università di Pisa [Italy]

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