SESSION Invited talk 1 : MICROSYSTEM DEVELOPMENT

• Microsystem product development

SESSION 1 : PACKAGING AND ASSEMBLY

• 3D Assembly technology for hybrid integration of heterogenous devices
• Analysis of packaging effects on the performance of the microflown
• Ultra fine pitch flat panel display packaging using 3µm conductive particles
• Parasitic effects reduction for wafer-level packaging of RF-MEMS

SESSION 2 : DESIGN, ANALYSIS AND FABRICATION OF MEMS COMPONENTS

• 3-D self-assembled SOI MEMS : an example of multiphysics simulation
• Analytic model for perforated squeezed-film dampers
• Influence of the feedback filter on the response of the pulsed digital oscillator
• Design of bossed silicon membranes for high sensitivity microphone applications

SESSION 3 : FABRICATION METHODS

• Concave microlens array mold fabrication in photoresist using UV proximity printing
• Surface conditioning effect on vacuum microelectronics components fabricated by deep reactive ion etching
• Epitaxial PZT FILMS deposited by pulsed laser deposition for MEMS application

SESSION 4 : OPERATIONAL, YIELD AND RELIABILITY ANALYSIS OF MEMS

• Parametric yield analysis of MEMS via statistical methods
• Electromechanical reliability testing of three-axial silicon force sensors
• Resolution limits for resonant MEMS sensors based on discrete relay feedback techniques

SESSION Posters : INTRODUCTION SESSION I

• Packaging of RF MEMS switching functions on alumina substrate
• Influence of micro-cantilever geometry and gap on pull-in voltage
• Design and development of novel electroplating spring frame MEMS structure specimens for the microtensile testing of thin film materials
• A novel contact resistance model of anisotropic conductive film for FPD packaging
• Micro-ball lens array fabrication in photoresist using PTFE hydrophobic effect
• Quality factor of PZT thin film transduced micro cantilevers
• A generic surface micromachining module for MEMS hermetic packaging at temperatures below 200 °C
• Effect of surface finish of substrate on mechanical reliability of IN-48SN solder joints in MOEMS package

SESSION Posters : INTRODUCTION SESSION II

• AU-SN FLIP-CHIP solder bump for microelectronic and optoelectronic applications
• Contactless thermal characterization method of PCB-S using an IR sensor array
• AFM, SEM and nano/micro-indention studies of the FIB-MILLED glassy carbon surface heat-treated at different conditions
• High quality factor copper inducters integrated in deep dry etched quartz substrates
• A micro turbine device with enhanced micro air-bearings
• MEMS tunable capacitors with deep sub-micron transduction gaps
• Fabrication of silicon-on-insulator MEM resonators with deep sub-micron transduction gaps
• New internal stress driven on-chip micromachines for extracting mechanical properties of thin films
• The design and fabrication of platform device for DNA amplification
• Improvement of the photovoltaic current for the non-bias optical sensor in a layered film structure
• Electro hydrodynamic pumping of liquids in microchannels

SESSION 5 : HOT EMBOSSING

• Process issues for a multi-layer microelectrofluidic platform
• Design and fabrication of a novel light guiding plate for backlight system by MEMS technology
• Fabrication of switches on polymer-based by hot embossing

SESSION Session 6 : ELECTROSTATIC ACTUATION MODELS

• A new model of fringing capacitance and its application to the control of parallel-plate electrostatic micro actuators
• Model of electrostatic actuated deformable mirror using strongly coupled electro-mechanical finite element
• Reduced-order modelling of the bending of an array of torsional micro mirrors

SESSION 7 : MICRO DEVICES I

• High current densities in copper microcoils : influence of substrate on failure mode
• Integration of micro-electro-mechanical deformable mirrors in doped fiber amplifiers
• Characterization of flexible RF microcoil dedicated to surface MRI

SESSION 8 : MEMS IN BIOSYSTEMS

• Electrostatic actuators operating in liquid environment : suppression of pull-in instability and dynamic response
• Miniaturized fluorescence excitation platform with optical fiber for bio-detection chips
• Design and fabrication of a micro electrostatic vibration-to-electricity energy converter

SESSION 9 : MICRO DEVICES II

• An active chaotic micromixer integrating thermal actuation associating PDMS and silicon microtechnology
• Development of scanning MEMS mirror with new assembly structure
• Electrostatically-driven resonator on SOI with improved temparature stability

SESSION 10 : DESIGN AND ANALYSIS OF VIBRATION POWERED MICROGENERATORS

• Scaling effects for electromagnetic vibrational power generators
• Macro and micro scale electromagnetic kinetic energy harvesting generators
• Vibrational energy scavenging with SI technology electromagnetic inertial microgenerators
• Design and fabrication of a micro electrostatic vibration-to-electricity energy converter

SESSION 11 : CHARACTERIZATION

• Capacitive test-structures design methodology for the extraction of AIR-GAP and dielectric thickness of a MEMS process
• Measurement technique for elastic and mechanical properties of polycrystalline silicon-germanium films using surface acoustic waves and projection masks
• The effects of additives on the physical properties of electroformed nickel components
• Characterization of the etching quality in micro-electro-mechanical systems by thermal transient methodology

SESSION 12 : INTEGRATION OF MICRO POWER GENERATORS

• Motion-based generators for industrial applications
• Power processing circuits for MEMS inertial energy scavengers
• Optimization of piezoelectric electrical generators powered by random vibrations
• Non linear techniques for increasing harvesting energy from piezoelectric and electromagnetic micro-power-generators

SESSION 13 : MINIATURIZED POWER GENERATORS

• Recent developments in MEMS-BASED micro fuel cells
• Above IC micro-power generators for RF-MEMS
• A silicon-based micro gas turbine engine for power generation

SESSION - : LATE MANUSCRIPT

• Characterization of friction during the demolding of microstructures molded by hot embossing