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Showing 4 out of a total of 4 results for community: EDA Publishing Association - DTIP conferences. (0.013 seconds)
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(EDA Publishing, Grenoble, France, 2008)This work relates to a novel piezoelectric transformer to be used in an autonomous sensor unit, possibly in conjunction with a RF-MEMS retro-modulator....
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(TIMA Editions , Grenoble, France, 2006)This paper deals with a single-crystal-silicon (SCS) MEMS resonator with improved temperature stability. While simulations have shown that the temperature coefficient of resonant frequency can be down to 1 ppm/°C, preliminary measurements on non-optimised structures gave evidence of a temperature coefficient of 29 ppm/°C. Design, optimisation, experimental results with post process simulation and prospective work are presented....
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(EDA Publishing Association, Grenoble, France, 2007)In this paper, design, fabrication and characterization issues of a bulk silicon-based, vibration powered, electric energy generator are addressed. The converter is based on an In-Plane Overlap Plate (IPOP) configuration [1]. Measurements have shown that with a theoretically lossless electronics and a starting voltage of 5 V, power density of 58 µW/cm3 is achievable at the resonance frequency of 290 Hz. It can be further improved by reducing the parasitic capacitance, which can be achieved by silicon etching, but a considerable mass is lost. In [2], it is shown that 19% of mass reduction improves power density from 12.95 µW/cm3 to 59 µW/cm3. Hence an enhancement in fabrication process is proposed, which is termed as Backside DRIE. It helps in increasing power density without loosing an important quantity of mass. Simulations have shown that 2.5% of mass removal improves power density up to 76.71 µW/cm3. Initial simulation results and problems of associated electronics are also discussed....
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(TIMA Editions , Grenoble, France, 2006)Advances in material processing such as silicon micromachining are opening the way to vacuum microelectronics. Two-dimensional vacuum components can be fabricated using the microsystems processes. We developed such devices using a single metal layer and silicon micromachining by DRIE. The latter technological step has significant impact on the characteristics of the vacuum components. This paper presents a brief summary of electron emission possibilities and the design leading to the fabrication of a lateral field emission diode. First measurement results and the aging of the devices are also discussed....
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