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Now showing items 1-20 of 216

0-level Vacuum Packaging RT Process for MEMS Resonators

Abel窠N.; Grogg, D.; Hibert, C.; Casset, F.; Ancey, P.; Ionescu, M. (EDA Publishing Association , Grenoble, France, 2007)
2-D Analysis of Enhancement of Analytes Adsorption Due to Flow Stirring by Electrothermal Force in The Microcantilever Sensor

Wu, M.C.; Chang, J.S.; Yang, K.C. (EDA Publishing Association , Grenoble, France, 2007)
3D Assembly technology for hybrid integration of heterogenous devices

Jung, E.; Schmitz, S.; Kaschlun, K.; Magagni, L.; Fazzi, A.; Guerrieri, R.; Canegallo, R. (TIMA Editions , Grenoble, France, 2006)
3-D self-assembled SOI MEMS : an example of multiphysics simulation

Louis, C.; Paquay, S.; De Vincenzo, P.; Klapka, I.; Rochus, V.; Iker, F.; André, Nicolas; Raskin, J.-P.; Mendez, C. (TIMA Editions , Grenoble, France, 2006)
Above IC micro-power generators for RF-MEMS

Oukassi, S.; Salot, R.; Bancel, S.; Pereira-Ramos, J.-P.; Gagnard, X. (TIMA Editions , Grenoble, France, 2006)
An active chaotic micromixer integrating thermal actuation associating PDMS and silicon microtechnology

Français, O.; Jullien, M.-C.; Rousseau, L.; Poulichet, P.; Desportes, S.; Chouai, A.; Lefevre, J.-P.; Delaire, J. (TIMA Editions , Grenoble, France, 2006)
AFM, SEM and nano/micro-indention studies of the FIB-MILLED glassy carbon surface heat-treated at different conditions

Youn, S.-W.; Takahashi, M.; Goto, H.; Maeda, R.; Kobayashi, N. (TIMA Editions , Grenoble, France, 2006)
Analysis of Asymmetric Piezoelectric Composite Beam

Chen, J.-S.; Chen, S.-H.; Wu, K.-C. (EDA Publishing Association , Grenoble, France, 2007)
Analysis of packaging effects on the performance of the microflown

Yntema, D.-R.; Dijkstra, M.; Svetovoy, V.-B.; Wiegerink, R.-J.; Elwenspoek, M.; Van Honschoten, J. (TIMA Editions , Grenoble, France, 2006)
Analysis of polysilicon micro beams buckling with temperature-dependent properties

Shamshirsaz, M.; Bahrami, M.; Asgari, M.B.; Tayefeh, M. (EDA Publishing Association , Grenoble, France, 2007)
Analytic model for perforated squeezed-film dampers

Veijola, T. (TIMA Editions , Grenoble, France, 2006)
ARCHITECTURE FOR INTEGRATED MEMS RESONATORS QUALITY FACTOR MEASUREMENT

Mathias, H.; Parrain, F.; Gilles, J.-P.; Megherbi, S.; Zhang, M.; Coste, Ph.; Dupret, A. (EDA Publishing Association, Grenoble, France, 2007)
AU-SN FLIP-CHIP solder bump for microelectronic and optoelectronic applications

Yoon, Jeong-Won; Koo, Ja-Myeong; Jung, Seung-Boo; Chun, Hyun-Suk (TIMA Editions , Grenoble, France, 2006)
Biodegradable Polylactic Acid (PLA) Microstructures for Scaffold Applications

Wang, G.-J.; Ho, K.-H.; Hsueh, C.-C. (EDA Publishing Association, Grenoble, France, 2007)
Bridge configurations in piezoresistive two-axis accelerometers

Halvorsen, E.; Husa, S. (EDA Publishing Association, Grenoble, France, 2007)
Capacitive test-structures design methodology for the extraction of AIR-GAP and dielectric thickness of a MEMS process

Bellei, M.; Margesin, B.; Gaddi, R.; Gnudi, A.; Giacomozzi, F. (TIMA Editions , Grenoble, France, 2006)
Cell Trapping Utilizing Insulator-based Dielectrophoresis in The Open-Top Microchannels

Jen, Chun-Ping; Huang, Yao-Hung; Chen, Teng-Wen (EDA Publishing, Grenoble, France, 2008)
CHARACTERISATION OF AN ELECTROSTATIC VIBRATION HARVESTER

Sterchen, T. M.; Altena, G.; Fiorini, P.; Puers, R (EDA Publishing Association, Grenoble, France, 2007)
Characterization and Modeling of an Electro-thermal MEMS Structure

Szabo, P.G.; Szekely, Vladimir (EDA Publishing, Grenoble, France, 2008)
Characterization of flexible RF microcoil dedicated to surface MRI

Woytasik, M.; Ginefri, J.-C.; Raynaud, J.-S.; Poirier-Quinot, M.; Dufour-Gergam, E.; Grandchamp, J.-P.; Darrasse, L.; Robert, P.; Gilles, J.-P.; Martincic, E.; Girard, O. (TIMA Editions , Grenoble, France, 2006)

Now showing items 1-20 of 216

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