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Now showing items 119-138 of 138

Thermal modelling of multi-finger AlGaN/GaN HEMTs

Oprins, H.; Das, J.; Vandersmissen, R.; Vandevelde, B.; Germain, M.; Ruythooren, W. (TIMA Editions , Grenoble, France, 2006)
THERMAL NETWORKS FROM PHONON BOLTZMANN'S TRANSPORT EQUATION: PART I - FUNDAMENTALS

Codecasa, L.; D'Amore, D.; Maffezzoni, P. (EDA Publishing Association, Grenoble, France, 2007)
THERMAL NETWORKS FROM PHONON BOLTZMANN'S TRANSPORT EQUATION PART II - COMPACT MODELING

Codecasa, L.; D'Amore, D.; Maffezzoni, P. (EDA Publishing Association, Grenoble, France, 2007)
Thermal properties of high power laser bars investigated by spatially resolved thermoreflectance spectroscopy

Tomm, J.W.; Pierścińska, D.; Pierściński, M.; Bugajski, M. (TIMA Editions , Grenoble, France, 2006)
Thermal Stress Failures : A New Experimental Approach For Prediction and Prevention

Hertl, M.; Fayolle, R.; Weidmann, D.; Lecomte, J.-C. (TIMA Editions , Grenoble, France, 2006)
Thermal Transient Multisource Simulation Using Cubic Spline Interpolation of Zth Functions

Schweitzer Dirk (TIMA Editions , Grenoble, France, 2006)
Thermal Transient Multisource Simulation Using Cubic Spline Interpolation of Zth Functions

Schweitzer, D. (TIMA Editions , Grenoble, France, 2006)
Thermionic refrigeration with planar and nonplanar electrodes - chances and limits

Gerstenmaier, Y.-C.; Wachutka, G. (TIMA Editions , Grenoble, France, 2006)
TherMos3, a tool for 3D electrothermal simulation of Smart Power Mosfets

Buonaiuto, G.; Irace, A.; Breglio, G.; Spirito, P. (TIMA Editions , Grenoble, France, 2006)
Transient compact modeling for multi chips components

Habra, W.; Tounsi, P.; Dorkel, J.-M. (TIMA Editions , Grenoble, France, 2006)
Transient Non-linear Thermal FEM Simulation of Smart Power Switches and Verification by Measurements

Kosel, V.; Sleik, R.; Glavanovics, Michael (EDA Publishing Association, Grenoble, France, 2007)
Transient thermal analysis & board level

Yu, J.-H.; Farkas, G.; van Voorst Vader, Q. (TIMA Editions , Grenoble, France, 2006)
Transient thermal simulation of a power hybrid module using an analytical solution of the heat equation

Janicki, M.; De Mey, G.; Napieralski, A. (TIMA Editions , Grenoble, France, 2006)
Two-Dimensional Temperature Fields in ASICs for Multiple Heat Sources of Arbitrary Power Dissipation Derived from Conformal Mapping Theory

Augustin, A.; Kostka, A.; Maj, B. (TIMA Editions , Grenoble, France, 2006)
Ultrafast temperature profile calculation in IC chips

Kemper, T.; Zhang, Y.; Bian, Z.; Shakouri, A. (TIMA Editions , Grenoble, France, 2006)
Ultra-local temperature mapping with an intrinsic thermocouple

Cretin, B.; Charlot, B.; Dilhaire, S.; Tessier, G.; Trannoy, N.; Volz, S.; Vairac, P.; Genix, M.; Gomès, S. (TIMA Editions , Grenoble, France, 2006)
Utility of transient testing to characterize thermal interface materials

Smith, B.; Brunschwiler, T.; Michel, B. (EDA Publishing Association, Grenoble, France, 2007)
Validation of the DJOSER analytical thermal simulator for electronic power devices and assembling structures

Bagnoli, P.-E.; Bartoli, C.; Stefani, F.; Franchi, E. (TIMA Editions , Grenoble, France, 2006)
Very Fast Chip-level Thermal Analysis

Nakabayashi, K.; Nakabayashi, T.; Nakajima, K. (EDA Publishing Association, Grenoble, France, 2007)
Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers

Szucs, Z.; Nagy, G.; Hodossy, S.; Rencz, M.; Poppe, A. (EDA Publishing Association, Grenoble, France, 2007)

Now showing items 119-138 of 138

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