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Now showing items 97-116 of 138

A scanning fluorescent probe for local temperature imaging of microelectronic circuits

Aigouy, L.; Tessier, G.; Charlot, B.; Mortier , M. (TIMA Editions , Grenoble, France, 2006)
Short time die attach characterisation of semiconductor devices

Szabo, P.; Rencz, M. (EDA Publishing Association, Grenoble, France, 2007)
The Sissy Electro-thermal Simulation System - Based on Modern Software Technologies

Poppe, A.; Horváth, G. (TIMA Editions , Grenoble, France, 2006)
Smoke and CFD visualization of the flow after an EMIC screen in a subrack model

Antón, R.; Castiella, M.; Jonsson, H.; Moshfegh, B. (TIMA Editions , Grenoble, France, 2006)
Structure Function Representation of Multi-Directional Heat-Flows

Codecasa, L.; D'Amore, D.; Maffezzoni, P. (TIMA Editions , Grenoble, France, 2006)
Study of Water Speed Sensitivity in a Multifunctional Thick-film Sensor by Analytical Thermal Simulations and Experiments

Stefani, F.; Bagnoli, P.E.; Luschi, S. (EDA Publishing Association, Grenoble, France, 2007)
A Temperature Analysis of High-power AlGaN/GaN HEMTs

Das, J.; Oprins, H.; Ji, H.; Sarua, A.; Ruythooren, W.; Derluyn, J.; Kuball, M.; Germain, M.; Borghs, G. (TIMA Editions , Grenoble, France, 2006)
Temperature Gradient Alleviating Method for Arithmetic Units

Egawa, R.; Ito, M.; Hasegawa, N.; Nakamura, T.; Suzuki, K.-I. (TIMA Editions , Grenoble, France, 2006)
Temperature measurement in the Intel® CoreTM Duo Processor

Rotem, E.; Hermerding, J.; Cohen, A.; Cain, H. (TIMA Editions , Grenoble, France, 2006)
Temperature Measurement of Sub-micrometric ICs by Scanning Thermal Microscopy

Nepveu, F.; Trannoy, N.; Volz, S.; Charlot, B.; Tessier, G.; Dilhaire, S.; Cretin, B.; Vairac, P.; Gomès, S.; Chapuis, O. (TIMA Editions , Grenoble, France, 2006)
Theoretical investigation of thermal feedback effects in low-power circuits

Kuuse, M.; Loikkanen, M.; Bognár, G. (TIMA Editions , Grenoble, France, 2006)
Thermal And Mechanical Analysis of High-power Light-emitting Diodes with Ceramic Packages

Hu, J.; Yang, L.; Shin, M.-W. (EDA Publishing Association, Grenoble, France, 2007)
Thermal and Sensitivity Analysis of Multi-Fin Devices

Swahn, B.; Hassoun, S. (TIMA Editions , Grenoble, France, 2006)
Thermal And Thermo-Mechanical Modelling of Polymer Overmoulded Electronics

Sarvar, F.; Teh, N.-J.; Whalley, D.-C.; Hutt, D.-A.; Palmer, P.-J. (TIMA Editions , Grenoble, France, 2006)
Thermal-aware design rules for nanometer ICs

Rossello, J.-L.; Bota, S.; Keshavarzi, A.; Segura, J.; Rosales, M. (TIMA Editions , Grenoble, France, 2006)
Thermal Benchmark and Power Benchmark Software

Marcu, M.; Vladutiu, M.; Moldovan, H.; Popa, M. (TIMA Editions , Grenoble, France, 2006)
Thermal Design of Power Semiconductor Modules for Mobile Communication Systems

Osone, Y. (TIMA Editions , Grenoble, France, 2006)
Thermal Fatigue Assessment of Lead-Free Solder Joints

Shiratori, M.; Yu, Qiang (TIMA Editions , Grenoble, France, 2006)
Thermal imaging of Si, GaAs AND GaN -based devices within the microtherm project

Pavageau, S.; Tessier, G.; Filloy, C.; Jerosolimski, G.; Fournier, D.; Polignano, M.-L.; Mica, I.; Cassette, S.; Aubry, R.; Durand, O. (TIMA Editions , Grenoble, France, 2006)
Thermal measurement and modeling of multi-die packages

Poppe, A.; Zhang, Y.; Wilson, J.; Farkas, G.; Szabo, P.; Parry, J. (TIMA Editions , Grenoble, France, 2006)

Now showing items 97-116 of 138

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