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Browsing EDA Publishing Association - THERMINIC conferences by Title

Now showing items 1-20 of 138

-55°C to 170°C high linear voltage references circuitry in 0.18ìm CMOS technology

Tzuo-sheng Tsai, J.; Chiueh, H. (TIMA Editions , Grenoble, France, 2006)
Acoustically Enhanced Boiling Heat Transfer

Douglas, Z. W.; Smith, M. K.; Glezer, A. (EDA Publishing Association, Grenoble, France, 2007)
An Adaptive-Grain Thermal Simulation Method to Evaluate Effects of Spatio-Temporal Analysis Granularity upon The Thermal Behavior of VLSIs

Ito, M.; Hesegawa, N.; Egawa, R.; Suzuki, K.I.; Nakamura, T. (TIMA Editions , Grenoble, France, 2006)
Advanced Compact Thermal Modeling by using VHDL-AMS

Habra, W.; Tounsi, P.; Dorkel, J.-M. (TIMA Editions , Grenoble, France, 2006)
Advanced temperature measurements at Sub-Micron scales

Volz, S. (TIMA Editions , Grenoble, France, 2006)
Advancement of Multifunctional support structure technologies (AMFSST)

John, R.; Atxaga, G.; Frerker, H. J.; Newerla, A. (EDA Publishing Association, Grenoble, France, 2007)
Analytical thermal stress modeling in physical design for reliability of micro and opto electronic systems : Role, attributes, challenges, results

Suhir, E. (TIMA Editions , Grenoble, France, 2006)
The application of Artificial Neural Network for the assessment of thermal properties of multi-layer semiconductor structure

Suszynski, Z.; Kosikowski, M.; Duer, R. (TIMA Editions , Grenoble, France, 2006)
Application of Structure Functions for the Investigation of Forced Air Cooling

Janicki, M.; De Mey, G.; Kaminski, M.; Vermeersch, B.; Napieralski, A. (EDA Publishing Association, Grenoble, France, 2007)
An Approach to The Electrical Characterization of Analog Blocks through Thermal Measurements

Mateo, D.; Altet, J.; Aldrete-Vidrio, E. (TIMA Editions , Grenoble, France, 2006)
Bonding Semiconductor Laser Chips : Substrate Material Figure of Merit and Die Attach Layer Influence

Mottin, J.; Matuschek, N.; Bosshard, C.; Pliska, A.-C. (TIMA Editions , Grenoble, France, 2006)
Canonical Forms of Multi-Port Dynamic Thermal Networks

Codecasa, L.; D'Amore, D.; Maffezzoni, P. (TIMA Editions , Grenoble, France, 2006)
CCD thermoreflectance thermography system : methodology and experimental validation

Raad, P.-E.; Burzo, M.; Komarov, P.-L. (TIMA Editions , Grenoble, France, 2006)
The Characteristics of Electromigration And Thermomigration in Flip Chip Solder Joints

Yang, D.; Chan, Y.C. (EDA Publishing Association, Grenoble, France, 2007)
Characterization of thermal interface materials to support thermal simulation

Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H. (TIMA Editions , Grenoble, France, 2006)
Combination of Thermal Subsystems Modelled by Rapid Circuit Transformation

Kiffe, W.; Wachutka, G. (EDA Publishing Association, Grenoble, France, 2007)
A comprehensive thermal-aware power mangement system with block-level optimization in 100nm CMOS technology

Chen, W.-M.; Chiueh, H. (TIMA Editions , Grenoble, France, 2006)
Contactless thermal characterization method of PCB-S using different IR sensor arrays

Bognár, G.; Rencz, M.; Szekely, V. (TIMA Editions , Grenoble, France, 2006)
A Coupled Thermoreflectance Thermography Experimental System and Ultra-Fast Adaptive Computational Engine for the Complete Thermal Characterization of Three-Dimensional Electronic Devices : Validation

Burzo, M.; Raad, P.-E.; Komarov, P.-L. (TIMA Editions , Grenoble, France, 2006)
Creating temperature dependent Ni-MH battery models for low power mobile devices

Szente-Varga, D.; Rencz, M.; Horváth, G. (TIMA Editions , Grenoble, France, 2006)

Now showing items 1-20 of 138

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