Megasonic Enhanced Electrodeposition

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Title: Megasonic Enhanced Electrodeposition
Author: Kaufmann, Jens Georg; Desmulliez, Marc; Price, D.
Abstract: A novel way of filling high aspect ratio vertical interconnection (microvias) with an aspect ratio of >2:1 is presented. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst-diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. Higher throughput and better control over the deposition properties are possible for the manufacturing of interconnections and metal-based MEMS.
Publisher: EDA Publishing, Grenoble, France
Date: 2008

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