2008 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

RELIABILITY AND FAILURE ANALYSIS

• The Failure Mechanisms of Micro-scale Cantilevers in Shock And Vibration Stimuli
• Micro-tensile tests on micromachined metal on polymer specimens : elasticity, plasticity and rupture
• Mechanical Fatigue on Gold MEMS Devices : Experimental Results

ASSEMBLY AND PACKAGING

• Open Ended Microwave Oven for Packaging
• PACKAGE HERMETICITY TESTING WITH THERMAL TRANSIENT MEASUREMENTS

Special session 1a : ON MICRO POWER GENERATORS AND MICRO ENERGY SOURCES (PART I)

• DESIGN AND FABRICATION OF ACOUSTIC WAVE ACTUATED MICRO-GENERATOR
• Optimization of efficiency and energy density of passive micro fuel cells and galvanic hydrogen generators
• A Novel Piezoelectric Microtransformer for Autonmous Sensors Applications
• Flexible Micro Thermoelectric Generator based on Electroplated Bi2Te3
• LINEAR AND NON LINEAR BEHAVIOUR OF MECHANICAL RESONATORS FOR OPTIMIZED INERTIAL ELECTROMAGNETIC MICROGENERATORS

DEVICES AND COMPONENTS

• Design and Fabrication of a Novel Micro Electromagnetic Actuator
• A New Four States High Deflection Low Actuation Voltage Electrostatic Mems Switch for RF Applications
• High Quality Factor Silicon Cantilever Driven by PZT Actuator for Resonant Based Mass Detection
• Low Voltage Totally Free Flexible RF MEMS Switch With Anti-Stiction System
• ON-CHIP HOTPLATE FOR TEMPERATURE CONTROL OF CMOS SAW RESONATORS

STRUCTURED DESIGN METHODOLOGIES AND CAD

• Modelling methodology of MEMS structures based on Cosserat theory
• Haptic sensing for MEMS with application for cantilever and Casimir effect
• Noise Analysis and Noise-based Optimization for Resonant MEMS Structures
• Next Generation of TCAD Environments for MEMS Design
• Rejection of Power Supply Noise in Wheatstone Bridges : Application to Piezoresistive MEMS.
• STUDY OF FIRST-ORDER THERMAL SIGMA-DELTA ARCHITECTURE FOR CONVECTIVE ACCELEROMETERS

Special session: ON 3D TSVs

• High Density Through Silicon Via (TSV)
• Fabrication of 3D Packaging TSV using DRIE
• A Low-cost Through Via Interconnection for ISM WLP
• Through Silicon Vias as Enablers for 3D Systems
• Technologies for 3D Heterogeneous Integration
• Copper Electrodeposition for 3D Integration

Posters: INTRODUCTION AND VIEWING

• Process nano scale mechanical properties measurement of thin metal films using a novel paddle cantilever test structure
• High Q-factor CMOS-MEMS inductor
• A Microcantilever-based Gas Flow Sensor for Flow Rate and Direction Detection
• Simulation of Coating -Visco-Elastic liquid in the Mico-Nip of Metering Size Press
• HIGH DENSITY OUT-OF-PLANE MICROPROBE ARRAY
• A Nanostructual Microwave Probe Used for Atomic Force Microscope
• High Aspect Pattern Formation by Integration of Micro Inkjetting and Electroless Plating
• INTEGRATED 3D SOUND INTENSITY SENSOR WITH FOUR-WIRE PARTICLE VELOCITY SENSORS
• Model Based Sensor System for Temperature Measurement in R744 Air Conditioning Systems
• Design And Fabrication of High Numerical Aperture And Low Aberration Bi-Convex Micro Lens Array
• Micromachined Inclinometer Based on Fluid Convection
• DESIGN OPTIMIZATION FOR AN ELECTRO-THERMALLY ACTUATED POLYMERIC MICROGRIPPER
• New high fill-factor triangular micro-lens array fabrication method using UV proximity printing
• Micro-electroforming metallic bipolar electrodes for mini-DMFC stacks
• On the determination of Poisson’s ratio of stressed monolayer and bilayer submicron thick films
• Wafer Level Package for Image Sensor Module
• Numerical Investigation of Laser-Assisted Nanoimprinting on a Copper Substrate from a Perspective of Heat Transfer Analysis

MULTIPHYSICS MODELING AND SIMULATION

• Validation of compact models of microcantilever actuators for RF-MEMS application
• Numerical and Compact Modelling of Squeeze-Film Damping in RF MEMS Resonators
• A piecewise-linear reduced-order model of squeeze-film damping for deformable structures including large displacement effects
• RF-MEMS beam components : FEM modelling and experimental identification of pull-in in presence of residual stress

8-2 : DEVICES AND COMPONENTS

• Comparison Between Damping Coefficients of Measured Perforated Micromechanical Test Structures and Compact Models
• SINGLE CHIP SENSING OF MULTIPLE GAS FLOWS
• Low-Drift Flow Sensor with Zero-Offset Thermopile-Based Power Feedback
• RF-MEMS Switched Varactors for Medium Power Applications
• In-Plane Bistable Nanowire For Memory Devices
• GEOMETRICAL VARIATION ANALYSIS OF AN ELECTROTHERMALLY DRIVEN POLYSILICON MICROACTUATOR

Special session: ON BIO-MEMS

• HOT ROLLER EMBOSSING FOR THE CREATION OF MICROFLUIDIC DEVICES
• Fabrication of Embedded Microvalve on PMMA Microfluidic Devices through Surface Functionalization
• Portable Valve-less Peristaltic Micro-pump Design and Fabrication
• Microfluidic Device for Continuous Magnetophoretic Separation of Red Blood Cells
• Design and Analysis of a Chaotic Micromixer with Vortices Modulation
• High Performance Microreactor for Rapid Fluid Mixing and Redox Reaction of Ascorbic Acid
• Cell Trapping Utilizing Insulator-based Dielectrophoresis in The Open-Top Microchannels
• Fabrication of Nanostructured PLGA Scaffolds Using Anodic Aluminum Oxide Templates

Special session : ON MICRO POWER GENERATORS AND MICRO ENERGY SOURCES (PART II)

• Simulation of an Electrostatic Energy Harvester at Large Amplitude Narrow and Wide Band Vibrations
• Optimization and AMS Modeling for Design of an Electrostatic Vibration Energy Harvester’s Conditioning Circuit with an Auto-Adaptive Process to the External Vibration Changes
• Top-Down Behavioral Modeling Methodology of a Piezoelectric Microgenerator For Integrated Power Harvesting Systems
• Hybridization of Magnetism and Piezoelectricity for an Energy Scavenger based on Temporal Variation of Temperature

INTEGRATED PROCESSES

• Large Area Roller Embossing of Multilayered Ceramic Green Composites
• Study of mechanical response in embossing of ceramic green substrate by micro-indentation
• Manufacturing of A micro probe using supersonic aided electrolysis process
• Sub-µ structured Lotus Surfaces Manufacturing

CHARACTERIZATION

• Processing and Characterization of Precision Microparts from Nickel-based Materials
• Measurement of Large Forces and Deflections in Microstructures
• CONTACTLESS THERMAL CHARACTERIZATION OF HIGH TEMPERATURE TEST
• Characterization and Modeling of an Electro-thermal MEMS Structure

MANUFACTURING

• Micro Embossing of Ceramic Green Substrates for Micro Devices
• UV Direct-Writing of Metals on Polyimide
• Design Methodology and Manufacture of a Microinductor
• Megasonic Enhanced Electrodeposition

8-3: DEVICES AND COMPONENTS

• Integrated RF MEMS/CMOS Devices
• Porous Alumina Based Capacitive MEMS RH Sensor
• Design And Fabrication of Condenser Microphone Using Wafer Transfer And Micro-electroplating Technique