Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers

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URI: http://hdl.handle.net/2042/14687
Title: Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers
Author: Szucs, Z.; Nagy, G.; Hodossy, S.; Rencz, M.; Poppe, A.
Abstract: In this paper vibration combined high temperature cycle tests for packaged capacitive SOI-MEMS accelerometers are presented. The aim of these tests is to provide useful Design for Reliability information for MEMS designers. A high temperature test chamber and a chopper-stabilized read-out circuitry were designed and realized at BME - DED. Twenty thermal cycles of combined Temperature Cycle Test and Fatigue Vibration Test has been carried out on 5 samples. Statistical evaluation of the test results showed that degradation has started in 3 out of the 5 samples.
Subject: Vibration, temperature cycle tests, reliability, MEMS
Publisher: EDA Publishing Association, Grenoble, France
Date: 2007

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