I-Revues
Contact2007 - 13th International Worshop on THERMal INvestigations of ICs and Systems
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Session 1: TRANSIENT THERMAL CHARACTERISATION
- Application of Structure Functions for the Investigation of Forced Air Cooling
- Utility of transient testing to characterize thermal interface materials
- Short time die attach characterisation of semiconductor devices
- Method of Images for the Fast Calculation of Temperature Distributions in Packaged VLSI Chips
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Session 2: RELIABILITY OF SOLDER JOINTS
- New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction between Design Factors
- Evaluation Technique for The Failure Life Scatter of Lead-Free Solder Joints in Electronic Device
- Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package
- The Characteristics of Electromigration And Thermomigration in Flip Chip Solder Joints
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Session 3: MICROSCALE COOLING
- Development of EHD Ion-Drag Micropump for Microscale Electronics Cooling Systems
- Numerically Investigating the Effects of Cross Links in Scaled Microchannel Heat Sinks
- Dependency of Heat Transfer Rate on the Brinkman Number in Microchannels
- A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices
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POSTERS INTRODUCTION AND VIEWING
- Development of the Micro Capillary Pumped Loop for Electronic Cooling
- Thermal And Mechanical Analysis of High-power Light-emitting Diodes with Ceramic Packages
- Very Fast Chip-level Thermal Analysis
- Investigation of Micro Porosity Sintered wick in Vapor Chamber for Fan Less Design
- Study of Water Speed Sensitivity in a Multifunctional Thick-film Sensor by Analytical Thermal Simulations and Experiments
- Advancement of Multifunctional support structure technologies (AMFSST)
- Non-destructive failure analysis and modelling of encapsulated miniature SMD ceramic chip capacitors using thermal and mechanical loading
- Transient Non-linear Thermal FEM Simulation of Smart Power Switches and Verification by Measurements
- Combination of Thermal Subsystems Modelled by Rapid Circuit Transformation
- A Novel Thermal Position Sensor Integrated On A Plastic Substrate
- Influence of Transparent Surface Layer on Effective Thermoreflectance Coefficient of Typical Stacked Electronic Structures
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Invited talk 2: HIGH PERFORMANCE THERMAL INTERFACE TECHNOLOGY OVERVIEW
- HIGH PERFORMANCE THERMAL INTERFACE TECHNOLOGY OVERVIEW
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Session 4: PROGRESS IN COMPACT MODELLING THEORY
- Flexible profile approach to the conjugate heat transfer problem
- A NEW METHODOLOGY FOR EXTRACTION OF DYNAMIC COMPACT THERMAL MODELS
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Session 5: ADVANCES IN COOLING TECHNOLOGIES
- Acoustically Enhanced Boiling Heat Transfer
- Fully integrated one phase liquid cooling system for organic boards
- DEVELOPMENT OF A PROTOTYPE THERMAL MANAGEMENT SOLUTION FOR 3-D STACKED CHIP ELECTRONICS BY INTERLEAVED SOLID SPREADERS AND SYNTHETIC JETS
- Evaluation of Cooling Solutions for Outdoor Electronics
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Session 6: DEVELOPMENTS IN EXPERIMENTAL ANALYSIS
- Investigation of Thermal Processes in High Power Laser Bars by Thermoreflectance Spectroscopy
- Joule Expansion Imaging Techniques on Microlectronic Devices
- IMPROVEMENTS OF THE VARIABLE THERMAL RESISTANCE
- MICRO-HOTPLATES FOR THERMAL CHARACTERISATION OF STRUCTURAL MATERIALS OF MEMS
- A Modular High-Temperature Measurement Set-Up for Semiconductor Device Characterization
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Session 7: MULTI-PHYSICS SIMULATION
- Dynamic Electrothermal Simulation of Integrated Resistors at Device Level
- Lumped and Distributed Parameter SPICE Models of TE Devices Considering Temperature Dependent Material Properties
- Optimal Sensor Configuring Techniques for The Compensation of Thermo-Elastic Deformations in High-Precision Systems
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Session 8: PACKAGE RELIABILITY
- Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers
- Reducing Average and Peak Temperatures of VLSI CMOS Digital Circuits by Means of Heuristic Scheduling Algorithm
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Late Papers
- THERMAL NETWORKS FROM PHONON BOLTZMANN'S TRANSPORT EQUATION: PART I - FUNDAMENTALS
- THERMAL NETWORKS FROM PHONON BOLTZMANN'S TRANSPORT EQUATION PART II - COMPACT MODELING
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Recent Submissions
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(EDA Publishing Association, Grenoble, France, 2007)
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(EDA Publishing Association, Grenoble, France, 2007)
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(EDA Publishing Association, Grenoble, France, 2007)
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(EDA Publishing Association, Grenoble, France, 2007)
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(EDA Publishing Association, Grenoble, France, 2007)
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