• THERMAL NETWORKS FROM PHONON BOLTZMANN'S TRANSPORT EQUATION PART II - COMPACT MODELING

  Codecasa, L.; D'Amore, D.; Maffezzoni, P. (EDA Publishing Association, Grenoble, France, 2007)

  
• THERMAL NETWORKS FROM PHONON BOLTZMANN'S TRANSPORT EQUATION: PART I - FUNDAMENTALS

  Codecasa, L.; D'Amore, D.; Maffezzoni, P. (EDA Publishing Association, Grenoble, France, 2007)

  
• Reducing Average and Peak Temperatures of VLSI CMOS Digital Circuits by Means of Heuristic Scheduling Algorithm

  Szczesniak, W. (EDA Publishing Association, Grenoble, France, 2007)

  
• Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers

  Szucs, Z.; Nagy, G.; Hodossy, S.; Rencz, M.; Poppe, A. (EDA Publishing Association, Grenoble, France, 2007)

  
• Optimal Sensor Configuring Techniques for The Compensation of Thermo-Elastic Deformations in High-Precision Systems

  Koevoets, A.H.; Eggink, H.J.; Sanden, J. van der; Dekkers, J.; Ruijl, T.A.M. (EDA Publishing Association, Grenoble, France, 2007)

  
• Lumped and Distributed Parameter SPICE Models of TE Devices Considering Temperature Dependent Material Properties

  Salazar, J.; Turo, A.; Garcia, M. J.; Chavez, J. A. (EDA Publishing Association, Grenoble, France, 2007)

  
• Dynamic Electrothermal Simulation of Integrated Resistors at Device Level

  Vermeersch, B.; De Mey, G. (EDA Publishing Association, Grenoble, France, 2007)

  
• A Modular High-Temperature Measurement Set-Up for Semiconductor Device Characterization

  Borthen, P.; Wachutka, G. (EDA Publishing Association, Grenoble, France, 2007)

  
• MICRO-HOTPLATES FOR THERMAL CHARACTERISATION OF STRUCTURAL MATERIALS OF MEMS

  Furjes, P.; Csikvari, P.; Barsony, I.; Dücso, Cs. (EDA Publishing Association, Grenoble, France, 2007)

  
• IMPROVEMENTS OF THE VARIABLE THERMAL RESISTANCE

  Szekely, V.; Török, S.; Kollar, E. (EDA Publishing Association, Grenoble, France, 2007)

  
• Joule Expansion Imaging Techniques on Microlectronic Devices

  Grauby, S.; Patino Lopez, L-D.; Salhi, A.; Puyoo, E.; Rampnoux, J.-M.; Claeys, W.; Dilhaire, S. (EDA Publishing Association, Grenoble, France, 2007)

  
• Investigation of Thermal Processes in High Power Laser Bars by Thermoreflectance Spectroscopy

  Pierscinski, K.; Pierscinska, D.; Kozlowska, A.; Bugajski, M. (EDA Publishing Association, Grenoble, France, 2007)

  
• Evaluation of Cooling Solutions for Outdoor Electronics

  Wankhede, Mahendra; Khaire, V.; Goswami, A. (EDA Publishing Association, Grenoble, France, 2007)

  
• DEVELOPMENT OF A PROTOTYPE THERMAL MANAGEMENT SOLUTION FOR 3-D STACKED CHIP ELECTRONICS BY INTERLEAVED SOLID SPREADERS AND SYNTHETIC JETS

  Gerty, D.; Gerlach, D. W.; Joshi, Yogendra K.; Glezer, A. (EDA Publishing Association, Grenoble, France, 2007)

  
• Fully integrated one phase liquid cooling system for organic boards

  May, D.; Wunderle, B.; Schindler-Saefkow, F.; Nguyen, B.; Schacht, R.; Michel, B.; Reichl, H. (EDA Publishing Association, Grenoble, France, 2007)

  
• Acoustically Enhanced Boiling Heat Transfer

  Douglas, Z. W.; Smith, M. K.; Glezer, A. (EDA Publishing Association, Grenoble, France, 2007)

  
• A NEW METHODOLOGY FOR EXTRACTION OF DYNAMIC COMPACT THERMAL MODELS

  Habra, W.; Tounsi, P.; Madrid, F.; Dupuy, P.; Barbot, C.; Dorkel, J.-M. (EDA Publishing Association, Grenoble, France, 2007)

  
• Flexible profile approach to the conjugate heat transfer problem

  Sabry, M.-N. (EDA Publishing Association, Grenoble, France, 2007)

  
• HIGH PERFORMANCE THERMAL INTERFACE TECHNOLOGY OVERVIEW

  Linderman, T.; Brunschwiler, T.; Smith, B.; Michel B. (EDA Publishing Association, Grenoble, France, 2007)

  
• Influence of Transparent Surface Layer on Effective Thermoreflectance Coefficient of Typical Stacked Electronic Structures

  Komarov, P. L.; Burzo, M. G.; Raad, P. E. (EDA Publishing Association, Grenoble, France, 2007)

  

View more