2006 - Proceedings of 12th International Workshop on Thermal investigations of ICs
http://hdl.handle.net/2042/5993
Nice, Côte d’Azur, France, 27-29 September 2006Thu, 26 Nov 2020 16:40:37 GMT2020-11-26T16:40:37Z2006 - Proceedings of 12th International Workshop on Thermal investigations of ICshttp://documents.irevues.inist.fr:80/bitstream/id/8053/couv_therm_2006.jpg
http://hdl.handle.net/2042/5993
CCD thermoreflectance thermography system : methodology and experimental validation
http://hdl.handle.net/2042/6587
CCD thermoreflectance thermography system : methodology and experimental validation
Raad, P.-E.; Burzo, M.; Komarov, P.-L.
This work introduces a thermoreflectance-based system designed to measure the surface temperature field of activated microelectronic devices at submicron spatial resolution with either a laser or a CCD camera. The article describes the system, outlines the measurement methodology, and presents validation results. The thermo-reflectance thermography (TRTG) system is capable of acquiring device surface temperature fields at up to 512 512 points with 0.2 ƒÊm resolution. The setup and measurement methodology are presented, along with details of the calibration process required to convert changes in measured surface reflectivity to absolute temperatures. To demonstrate the systemfs capabilities, standard gold micro-resistors are activated and their surface temperature fields are measured. The results of the CCD camera and our existing laser-based measurement approaches are compared and found to be in very good agreement. Finally, the system is validated by comparing the temperatures obtained with the TRTG method with those obtained from electrical resistance measurements.
Sun, 01 Jan 2006 00:00:00 GMThttp://hdl.handle.net/2042/65872006-01-01T00:00:00ZUltrafast temperature profile calculation in IC chips
http://hdl.handle.net/2042/6586
Ultrafast temperature profile calculation in IC chips
Kemper, T.; Zhang, Y.; Bian, Z.; Shakouri, A.
One of the crucial steps in the design of an integrated circuit is the minimization of heating and temperature non-uniformity. Current temperature calculation methods, such as finite element analysis and resistor networks have considerable computation times, making them incompatible for use in routing and placement optimization algorithms. In an effort to reduce the computation time, we have developed a new method, deemed power blurring, for calculating temperature distributions using a matrix convolution technique in analogy with image blurring. For steady state analysis, power blurring was able to predict hot spot temperatures within 1°C with computation times 3 orders of magnitude faster than FEA. For transient analysis the computation times where enhanced by a factor of 1000 for a single pulse and around 100 for multiple frequency application, while predicting hot spot temperature within about 1°C. The main strength of the power blurring technique is that it exploits the dominant heat spreading in the silicon substrate and it uses superposition principle. With one or two finite element simulations, the temperature point spread function for a sophisticated package can be calculated. Additional simulations could be used to improve the accuracy of the point spread function in different locations on the chip. In this calculation, we considered the dominant heat transfer path through the back of the IC chip and the heat sink. Heat transfer from the top of the chip through metallization layers and the board is usually a small fraction of the total heat dissipation and it is neglected in this analysis.
Sun, 01 Jan 2006 00:00:00 GMThttp://hdl.handle.net/2042/65862006-01-01T00:00:00ZThermal Transient Multisource Simulation Using Cubic Spline Interpolation of Zth Functions
http://hdl.handle.net/2042/6585
Thermal Transient Multisource Simulation Using Cubic Spline Interpolation of Zth Functions
Schweitzer, D.
Multisource, Multichip, Thermal transient SimulationThis paper presents a very straightforward method to compute the transient thermal response to arbitrary power dissipation profiles in electronic devices with multiple heat sources. Using cubic spline interpolation of simulated or measured unit power step response curves (Zth-functions), additional errors due to model reduction can be avoided. No effort has to be spent on the generation of compact models. The simple analytic form of the interpolating splines can be exploited to evaluate the convolution integral of the Zth-functions with arbitrary power profiles at low computational costs. An implementation of the algorithm in a spreadsheet program (EXCEL) is demonstrated. The results are in very good agreement with temperature profiles computed by transient Finite Element simulation but can be obtained in a fraction of the time.
Sun, 01 Jan 2006 00:00:00 GMThttp://hdl.handle.net/2042/65852006-01-01T00:00:00ZThermal Transient Multisource Simulation Using Cubic Spline Interpolation of Zth Functions
http://hdl.handle.net/2042/6584
Thermal Transient Multisource Simulation Using Cubic Spline Interpolation of Zth Functions
Schweitzer Dirk
This paper presents a very straightforward method to
compute the transient thermal response to arbitrary power
dissipation profiles in electronic devices with multiple
heat sources. Using cubic spline interpolation of simulated
or measured unit power step response curves (Zthfunctions),
additional errors due to model reduction can
be avoided. No effort has to be spent on the generation of
compact models. The simple analytic form of the
interpolating splines can be exploited to evaluate the
convolution integral of the Zth-functions with arbitrary
power profiles at low computational costs. An implementation
of the algorithm in a spreadsheet program
(EXCEL) is demonstrated. The results are in very good
agreement with temperature profiles computed by
transient Finite Element simulation but can be obtained in
a fraction of the time.
Sun, 01 Jan 2006 00:00:00 GMThttp://hdl.handle.net/2042/65842006-01-01T00:00:00Z